: Eberhardt, R.; Scheller, T.; Menzel, E.-M.; Döring, M.; Lenhard, K.; Kopp, H.

Abstract
At the present time most conventional microassembly systems are viewed as not being able to fulfil the important requirements of microassembly tasks. Especially achieving a positioning accuracy of less than five pm has been only rarely possible. Assembly systems qualified for automated sequence of feeding, handling, inspection and joining. One possibility to increase the accuracy of an assembly system is the integration of an inspection system which detects actual joining positions and gives feedback information for correcting the actual position during the adhesive bonding process. Corrections are best achieved using small steps with high resolution.