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  4. Modularized Microelectromechanical Devices as Key Components for Advanced Intelligent Autonomous Sensors and Control Systems
 
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1997
Conference Paper
Title

Modularized Microelectromechanical Devices as Key Components for Advanced Intelligent Autonomous Sensors and Control Systems

Abstract
A highly flexible, modular design and production framework for microelectromechanical systems, suitable for mid-scale production at reasonable costs, is presented. The modular framework, similar to unit construction systems well-known in the macro world, consists of a manufacturer set and an application kit. It allows for considerable reduction of design and production expenditure whilst retaining maximum technical flexibility. The feasibility of the modular approach is demonstrated by the presentation and discussion of a novel modular vertical integration technique (TB2GA).
Author(s)
Schünemann, M.
Grosser, V.
Leutenbauer, R.
Matuscheck, P.
Schäfer, W.
Reichl, H.
Mainwork
Sensors and Controls for Advanced Manufacturing  
Conference
International Symposium on Intelligent Systems and Advanced Manufacturing 1997  
Language
English
Fraunhofer-Institut für Produktionstechnik und Automatisierung IPA  
Keyword(s)
  • Autonome Systeme

  • Autonomous control system

  • Fertigung

  • MEMS

  • mikroelektromechanisches System

  • Mikroelektronik

  • MikroFab

  • Mikromechanik

  • Modularisierung

  • Schnittstelle

  • sensor

  • standartization

  • Steuerung

  • Verpackung

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