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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Modularized Microelectromechanical Devices as Key Components for Advanced Intelligent Autonomous Sensors and Control Systems

: Schünemann, M.; Grosser, V.; Leutenbauer, R.; Matuscheck, P.; Schäfer, W.; Reichl, H.

	Nnaji, B.O.; Wang, A. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.: Sensors and Controls for Advanced Manufacturing Bellingham, Wash.: SPIE, 1997 (SPIE Proceedings Series 3201) ISBN: 0-8194-2633-4 pp.108-123
	International Symposium on Intelligent Systems and Advanced Manufacturing <1997, Pittsburgh>

	English
	Conference Paper
	Fraunhofer IPA ()
	Autonome Systeme; Autonomous control system; Fertigung; MEMS; mikroelektromechanisches System; Mikroelektronik; MikroFab; Mikromechanik; Modularisierung; Schnittstelle; sensor; standartization; Steuerung; Verpackung

Abstract
A highly flexible, modular design and production framework for microelectromechanical systems, suitable for mid-scale production at reasonable costs, is presented. The modular framework, similar to unit construction systems well-known in the macro world, consists of a manufacturer set and an application kit. It allows for considerable reduction of design and production expenditure whilst retaining maximum technical flexibility. The feasibility of the modular approach is demonstrated by the presentation and discussion of a novel modular vertical integration technique (TB2GA).