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Modeling the wafer temperature in a LPCVD furnace
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1995
Conference Paper
Titel
Modeling the wafer temperature in a LPCVD furnace
Author(s)
Kersch, A.
Schäfer, M.
Hauptwerk
6th International Conference on Simulation of Semiconductor Devices and Processes. SISDEP '95. Proceedings
Konferenz
International Conference on Simulation of Semiconductor Devices and Processes (SISDEP) 1995
Language
English
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