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Millimeter-wave performance of chip interconnections using wire bonding and flip chip

Bonddraht und Flip-chip Verbindungen für Halbleiter-Chips im Millimeterwellen-Frequenzbereich
: Krems, T.; Haydl, W.; Massler, H.; Rüdiger, J.


Kirby, L.:
IEEE MTT-S International Microwave Symposium Digest 1996. Vol.1
1996 (IEEE MTT-S International Microwave Symposium Digest)
International Microwave Symposium <1996, San Francisco/Calif.>
Conference Paper
Fraunhofer IAF ()
flipchip; interconnection; Millimeterwelle; MMW; Verbindungstechnik

The performances of two different interconnection techniques for coplanar MMICs, wire bonding and flip chip, are investigated at millimeter-wave frequencies. By developing an accurate model for the interconnections, which is validated with experimental data up to 120 GHz, the limitations with respect to frequency and interconnection distance of either technique are pointed out, yielding useful data for the design of hybrid MMW-subsystems.