Micromechanical component and process for manufacturing the same

: Zimmer, G.; Mokwa, W.

Abstract
The description refers to a micromechanical component comprising a substrate and a flat deformable element arranged in parallel to the surface of the substrate, the element being equipped with a mechanical/electrical signal converter. With known components, the deformable element is not electrically insulated from the substrate. They are therefore not suitable for common integration with electrical circuits in CMOS technology. The component according to the invention is characterized by the fact that the substrate and the deformable element are manufactured in one piece from a semiconductor substrate and are electrically insulated from each other. The insulation is obtained by a buried layer produced by ion implantation.