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Microstrip-to-Microstrip interconnects with adhesive bonded ribbons for micro- and millimeterwave applications
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1998
Conference Paper
Titel
Microstrip-to-Microstrip interconnects with adhesive bonded ribbons for micro- and millimeterwave applications
Author(s)
Pohlmann, W.
Jacob, A.F.
Schäfer, H.
Hennemann, O.-D.
Hauptwerk
3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998. Proceedings
Konferenz
International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998
DOI
10.1109/ADHES.1998.742010
Language
English
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Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM