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Micromechanical relay with electrostatic actuation

 
: Schiele, I.; Hillerich, B.; Kozlowski, F.; Evers, C.

:

Wise, K.D. ; IEEE Electron Devices Society:
Transducers '97. Digest of technical papers
Piscataway, NJ: IEEE, 1997
ISBN: 0-7803-3829-4
pp.1165-1168 : Lit. (Vol.2)
International Conference on Solid-State Sensors and Actuators <9, 1997, Chicago/Ill.>
English
Conference Paper
Fraunhofer IFT; 2000 dem IZM eingegliedert
contact resistance; electrostatic device; internal stress; micromachining; micromechanical devices; semiconductor relays

Abstract
Three variants of electrostatically driven microrelays are reported. The concepts of these microrelays are a cantilever beam, a fixed-fixed beam and a torsion beam with a double contact configuration. Because of the complete fabrication by surface micromachining technology, there is no need for a chip bonding process. This paper reports on the device concept, fabrication and performance of the microrelay.

: http://publica.fraunhofer.de/documents/PX-23945.html