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The microDAC method. A powerful means for microdeformation analysis in electronic packaging
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1997
Conference Paper
Title
The microDAC method. A powerful means for microdeformation analysis in electronic packaging
Author(s)
Michel, B.
Vogel, D.
Schubert, A.
Auersperg, J.
Reichl, H.
Mainwork
Applications of Experimental Mechanics to Electronic Packaging 1997
Conference
International Mechanical Engineering Congress and Exposition 1997
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
