
Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. The microDAC method. A powerful means for microdeformation analysis in electronic packaging
| Suhling, J.C. ; American Society of Mechanical Engineers -ASME-, Electrical and Electronic Packaging Division: Applications of Experimental Mechanics to Electronic Packaging 1997 New York, NY: ASME, 1997 (AMD 226) ISBN: 0-7918-1850-0 |
| International Mechanical Engineering Congress and Exposition <1997, Dallas/Tex.> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |