Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. The microDAC method. A powerful means for microdeformation analysis in electronic packaging
| Suhling, J.C. ; American Society of Mechanical Engineers -ASME-, Electrical and Electronic Packaging Division:
Applications of Experimental Mechanics to Electronic Packaging 1997
New York, NY: ASME, 1997 (AMD 226)
ISBN: 0-7918-1850-0 |
| International Mechanical Engineering Congress and Exposition <1997, Dallas/Tex.> |
|
| English |
| Conference Paper |
| Fraunhofer IZM () |