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Mechanical bumping for flipchip application

 
: Jung, E.; Nave, J.; Aschenbrenner, R.; Reichl, H.; Zakel, E.

Graaff, H.C. de; Kranburg, H. van:
ESSDERC '95. 25th European Solid State Device Research Conference. Proceedings
Editions Frontieres, 1995
ISBN: 2-86332-182-X
European Solid State Device Research Conference <25, 1995, The Hague>
English
Conference Paper
Fraunhofer IZM ()
adhesive bonding; flipchip; interconnection; mechanical bumping; reflow soldering; thermocompression

: http://publica.fraunhofer.de/documents/PX-23151.html