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Mechanical bumping for flipchip application
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1995
Conference Paper
Titel
Mechanical bumping for flipchip application
Author(s)
Jung, E.
Nave, J.
Aschenbrenner, R.
Reichl, H.
Zakel, E.
Hauptwerk
ESSDERC '95. 25th European Solid State Device Research Conference. Proceedings
Konferenz
European Solid State Device Research Conference 1995
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Tags
adhesive bonding
flipchip
interconnection
mechanical bumping
reflow soldering
thermocompression