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1997
Conference Paper
Titel
Measurement of PbSn and AuSn flip chip area bump thermal resistance
Abstract
Summary form only given. The thermal management of electronic packages has become increasingly important due to the trends towards higher packaging density and power dissipation. For specific high frequency applications, GaAs devices and MMICs are flip chip interconnected to improve electrical and thermal performance. Here, the flip chip bumps represent the only heat transfer path. The objective of this investigation was twofold: (1) to provide reliable data for the thermal resistance of flip chip area bonds, which is required for the design of electronic modules; and (2) to analyze the influence of materials selection, solder thickness, aging and reliability testing on the thermal resistance of flip chip bonds.
Language
English