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  4. Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
 
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1997
Journal Article
Title

Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates

Author(s)
Schubert, A.
Dudek, R.
Vogel, D.
Michel, B.
Reichl, H.
Journal
Advancing microelectronics  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • finite element analysis

  • flip-chip devices

  • plastic deformation

  • reliability

  • scanning electron microscopy

  • Soldering

  • thermal stress

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