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Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates

 
: Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H.

Advancing microelectronics 24 (1997), No.4, pp.29-32
English
Journal Article
Fraunhofer IZM ()
finite element analysis; flip-chip devices; plastic deformation; reliability; scanning electron microscopy; Soldering; thermal stress

: http://publica.fraunhofer.de/documents/PX-22980.html