Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
:
Schubert, A.
;
Dudek, R.
;
Vogel, D.
;
Michel, B.
;
Reichl, H.
Advancing microelectronics 24 (1997), No.4, pp.29-32
English
Journal Article
Fraunhofer IZM
(
)
finite element analysis
;
flip-chip devices
;
plastic deformation
;
reliability
;
scanning electron microscopy
;
Soldering
;
thermal stress
:
http://publica.fraunhofer.de/documents/PX-22980.html
