Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Mask aligners in advanced packaging

 

Solid state technology 41 (1998), No.3, pp.S13-S14
ISSN: 0038-111X
English
Journal Article
Fraunhofer IZM ()
integrated circuit interconnections; integrated circuit packaging; masks; multichip module; photolithography; tape automated bonding

Abstract
New packaging technologies, developed to support the increasing functionality and performance of today's and future IC generations, increasingly use photolithography for the fabrication of high-density interconnect layers and tape automated bonding (TAB) or solder bumps. Screen printing and physical vapor deposition into a metal mask are running into resolution and reliability limits where the highest performance is needed. We have found that photolithography by proximity printing with a mask aligner meets the technological and economic demands of the industry.

: http://publica.fraunhofer.de/documents/PX-22854.html