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Low cost flip chip bonding on FR-4 boards
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1995
Journal Article
Titel
Low cost flip chip bonding on FR-4 boards
Author(s)
Klöser, J.
Zakel, E.
Reichl, H.
Zeitschrift
Circuit World
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM