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LOESUNG UND VERFAHREN ZUM STROMLOSEN ABSCHEIDEN VON GOLDSCHICHTEN

Solution for current-less gold plating.
 
: Scheel, W.; Hannemann, M.; Schmidt, R.; Mueller, J.; Meyer, H.; Rehak, W.

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Frontpage ()

DE 1997-19745601 A: 19971008
DE 1997-19745601 A: 19971008
DE 19745601 C2: 20010712
C23C0018
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
NOVELTY - A solution for current-less gold plating contains, as gold(I) compound, complex(es) of Au(I) ions with amino-acids showing a complex-forming constant for Au(I) ions of at least 1010 or with salts of such acids, or the amino-acid (and/or salt) is an additional component in a solution containing Au(I) compound, reducing agent and solvent. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a current-less gold-plating process comprising: (1) coating the workpiece with a catalytic layer for current- less metal plating; and (2) treating the workpiece with the above solution. USE - For gold-plating printed circuit boards and semi- conductor circuits (claimed). ADVANTAGE - Enables the deposition of gold (or palladium etc.) from acid bath solutions at low temperature (e.g. room temperature) at a rate of more than 1 micron/hour. These solutions also show a stability (towards self-decomposition) which is not less than that of known systems.

: http://publica.fraunhofer.de/documents/PX-22234.html