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Lead/Tin (95/5 wt%) solder bumps for flip chip applications based on Ti:W(N)/Au/Cu underbump metallization
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1993
Conference Paper
Titel
Lead/Tin (95/5 wt%) solder bumps for flip chip applications based on Ti:W(N)/Au/Cu underbump metallization
Author(s)
Wolf, J.
Chmiel, G.
Reichl, H.
Hauptwerk
5th International TAB/Advanced Packaging Symposium 1993. Proceedings
Konferenz
International TAB/Advanced Packaging Symposium (ITAP) 1993
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM