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Klebtechnologie

 
: Hennemann, O.-D.

Hard and Soft, Fachbeilage Mikroperipherik (1989), No.1/2
ISSN: 0178-7586
German
Journal Article
Fraunhofer IFAM ()
Bestückungstechnik; Kleben; neue Aufbautechnik

Abstract
In the microelectronics progress is characterized by varied equiping technics of the printed circuit boards. In the past the components have been interconnected only. Today they are replaced or supplemented by different developments. The compulsion of a further, higher integration in connection with an increasing frequency of change of function requires further developments of new construction technics.

: http://publica.fraunhofer.de/documents/PX-20523.html