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Kleben - eine zukunftsweisende Aufbau- und Verbindungstechnik für die Mikroelektronik?

 
: Heßland, A.; Schäfer, H.

Reichl, H.:
Surface mount technologies, electronic systems & solutions, technologies, circuits & tools, hybrid & advanced packaging technologies 1996. Tagungsband
Berlin; Offenbach: VDE-Verlag, 1996
ISBN: 3-8007-2182-1
pp.125-131
SMT/ES&S/Hybrid <10, 1996, Nürnberg>
German
Conference Paper
Fraunhofer IFAM ()
adhesive; adhesive bonding; AVT; Kleben; Klebstoffe; microelectronics; Mikroelektronik; Verbinden; Verbindungstechnik

Abstract
Many parts of the microelectronic do not without adhesive bonding. Special functions wished by the applicants can often only be realized by using the adhesive bonding technology. This technology can also be used for increasing the profitability of products. The lecture gives a brief overview about the fundamental advantages of adhesive bonding, the main requirements to adhesive bonds in microelectronic, the state of the art in this field and the demand on new knowledge and further development.

: http://publica.fraunhofer.de/documents/PX-20489.html