• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Kleben - eine zukunftsweisende Aufbau- und Verbindungstechnik für die Mikroelektronik?
 
  • Details
  • Full
Options
1996
Conference Paper
Title

Kleben - eine zukunftsweisende Aufbau- und Verbindungstechnik für die Mikroelektronik?

Abstract
Many parts of the microelectronic do not without adhesive bonding. Special functions wished by the applicants can often only be realized by using the adhesive bonding technology. This technology can also be used for increasing the profitability of products. The lecture gives a brief overview about the fundamental advantages of adhesive bonding, the main requirements to adhesive bonds in microelectronic, the state of the art in this field and the demand on new knowledge and further development.
Author(s)
Heßland, A.
Schäfer, H.
Mainwork
Surface mount technologies, electronic systems & solutions, technologies, circuits & tools, hybrid & advanced packaging technologies 1996. Tagungsband  
Conference
SMT/ES&S/Hybrid 1996  
Language
German
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM  
Keyword(s)
  • adhesive

  • adhesive bonding

  • AVT

  • Kleben

  • Klebstoffe

  • microelectronics

  • Mikroelektronik

  • Verbinden

  • Verbindungstechnik

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024