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  4. Investigations of flip chip interconnections on green tape ceramic substrates
 
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1993
Conference Paper
Title

Investigations of flip chip interconnections on green tape ceramic substrates

Author(s)
Klöser, J.
Zakel, E.
Engelmann, G.
Distler, H.
Mainwork
5th International TAB/Advanced Packaging Symposium 1993. Proceedings  
Conference
International TAB/Advanced Packaging Symposium (ITAP) 1993  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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