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Investigations of flip chip interconnections on green tape ceramic substrates

 
: Klöser, J.; Zakel, E.; Engelmann, G.; Distler, H.

Semiconductor Technology Center, Inc.:
5th International TAB/Advanced Packaging Symposium 1993. Proceedings
Neffs, Pa.: Semiconductor Technology Center, 1993
International TAB/Advanced Packaging Symposium (ITAP) <5, 1993, San Jose/Calif.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/PX-20001.html