Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Investigations of flip chip interconnections on green tape ceramic substrates
| Semiconductor Technology Center, Inc.:
5th International TAB/Advanced Packaging Symposium 1993. Proceedings
Neffs, Pa.: Semiconductor Technology Center, 1993 |
| International TAB/Advanced Packaging Symposium (ITAP) <5, 1993, San Jose/Calif.> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |