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Integrated three-dimensional topography simulation of contact hole processing
Integrierte dreidimensionale Topographiesimulation von Kontaktlochprozessierung
A software package for the three-dimensional simulation of topography processes which has been developed within the European project PROMPT is described. The software is capable of simulating lithography, dry-etching and layer deposition processes. The individual modules have been integrated into a unified environment, thus allowing simulation of complete topography process sequences. As an example, a complete simulation consisting of lithography, dry-etching, and sputter deposition steps to open and fill a contact hole is shown. The simulation result is in good agreement with the experiment, i.e. a scanning electron microscopy image of the contact hole cross section.