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Infrared micromirror array with large pixel size and large deflection angle

: Wagner, B.; Reimer, K.; Maciossek, A.; Hofmann, U.

DOI: 10.1109/SENSOR.1997.613585

	Wise, K.D. ; IEEE Electron Devices Society: Transducers '97. Digest of technical papers Piscataway, NJ: IEEE, 1997 ISBN: 0-7803-3829-4 pp.75-78 (Vol.1)
	International Conference on Solid-State Sensors and Actuators <9, 1997, Chicago/Ill.>

	English
	Conference Paper
	Fraunhofer ISIT ()
	copper; electroplating; electrostatic device; integrated optics; lithography; microactuator; micromachining; mirror; polishing

Abstract
The paper presents a technological study for the realization of micromirrors which have both, a large pixel size (100 mu m*100 mu m) and a large mirror deflection angle (+or-15 degrees ). This specification requires a 13 mu m gap for electrostatic actuation. A metal surface micromachining process has been developed using thick resist UV- lithography, multiple electroplating, a copper sacrificial layer and a polishing process step. Using nonplanar electrodes the driving voltage of electrostatic actuators can be reduced by factors. Two different technologies to realize tapered electrodes are presented.

: http://publica.fraunhofer.de/documents/PX-18743.html