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Infrared micromirror array with large pixel size and large deflection angle

: Wagner, B.; Reimer, K.; Maciossek, A.; Hofmann, U.


Wise, K.D. ; IEEE Electron Devices Society:
Transducers '97. Digest of technical papers
Piscataway, NJ: IEEE, 1997
ISBN: 0-7803-3829-4
pp.75-78 (Vol.1)
International Conference on Solid-State Sensors and Actuators <9, 1997, Chicago/Ill.>
Conference Paper
Fraunhofer ISIT ()
copper; electroplating; electrostatic device; integrated optics; lithography; microactuator; micromachining; mirror; polishing

The paper presents a technological study for the realization of micromirrors which have both, a large pixel size (100 mu m*100 mu m) and a large mirror deflection angle (+or-15 degrees ). This specification requires a 13 mu m gap for electrostatic actuation. A metal surface micromachining process has been developed using thick resist UV- lithography, multiple electroplating, a copper sacrificial layer and a polishing process step. Using nonplanar electrodes the driving voltage of electrostatic actuators can be reduced by factors. Two different technologies to realize tapered electrodes are presented.