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Influences on the reliability of underfilled flip chips
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1997
Conference Paper
Titel
Influences on the reliability of underfilled flip chips
Author(s)
Becker, K.-F.
Jiang, H.
Ansorge, F.
Jung, E.
Zakel, E.
Reichl, H.
Hauptwerk
International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium 1997. Proceedings
Konferenz
International Flip Chip, Ball Grid Array, TAB, and Advanced Packaging Symposium 1997
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM