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Influences on the reliability of underfilled flip chips

 

Semiconductor Technology Center, Inc.:
International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium 1997. Proceedings
Neffs: Semiconductor Technology Center, 1997
International Flip Chip, Ball Grid Array, TAB, and Advanced Packaging Symposium <1997, Sunnyvale/Calif.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/PX-18565.html