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The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach

 

International Electronics Packaging Society -IEPS-:
International Electronics Packaging Conference 1996. Proceedings
Edina, Minn.: International Electronics Packaging Society, 1996
pp.14-25
International Electronics Packaging Conference <1996, Austin/Tex.>
English
Conference Paper
Fraunhofer IZM ()
ageing; automotive electronics; electroless deposition; environmental degradation; flip-chip devices; gold; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; laminate; mechanical testing; microassembling; multichip module; nickel; nickel alloys; Soldering; tin alloys

: http://publica.fraunhofer.de/documents/PX-18461.html