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1996
Conference Paper
Titel
Indentation cracking of brittle thin films on brittle substrates
Abstract
Observations are presented of cracking produced by spherical pointed indentations made onto brittle films on brittle substrates. The major emphasis is with TiN films on substrates of silicon and sapphire. A range of film thicknesses and two deposition temperatures are considered resulting in different microstructures and residual stresses. The observations with small spherical tipped indenters are found to be the most amenable to interpretation. Fracture mechanics is invoked to explain the basis of through film cracking and interface delamination cracking.
Language
English