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Improved control of TiN coating properties using cathodic arc evaporation with a pulsed bias.
Bessere Kontrollierbarkeit der TIN- Schichteigenschaften durch die Verwendung einer gepulsten Biasspannung im Arc-Prozeß
A combined d.c.-pulse vias voltage was used in combination with a cathodic arc evaporation process for the deposition of TiN on planar plates and drilling tools at substrate temperatures T between 330 and 500 xC. This new pulse technique appeared to be powerful tool to achieve independent control of the substrate temperature, coating adhesion and univormity of deposition. As a result, high coating adhesion can be obtained at low substrate temperatures. The adhesion uniformity across large-area samples is considerably improved. Unpolished rough substrate parts can be coated without cauliflower-like growth defects. Because of intensive ion bombardment in the pulse period, smoother TiN coatings with a reduced droplet size were obtained.