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1986
Journal Article
Titel
Highly-sensitive novolak-based positive x-ray resist
Abstract
Standard novolak-based resists (dissolution inhibitor/matrix resin) offer wellproven technological stability and are therefore most desirable for a future lithography method. Unfortunately the sensitivity towards x-rays is too low by at least a factor of 10, even for synchrotron radiation sources. To achieve higher sensitivities, the concept of chemical amplification is introduced into an inhibitor type resist. In this newly developed resist, the dissolution inhibitor is destroyed via a catalytic agent generated by the radiation and not by the radiation directly. For the first time, a novolak-based system has been developed, which fulfills all the requirements for a submicron-single-layer resist technology.