: Schünemann, M.; Grosser, V.; Leutenbauer, R.; Bauer, G.; Schäfer, W.; Reichl, H.

Abstract
A highly flexible modular design and production framework for microelectromechanical systems, suitable for midscale production at reasonable costs is introduced. The modular framework consists of a manufacturer set and an application kit. It allows for considerable reduction of design and production expenditure whilst retaining maximum technical flexibility. A novel package design for the realization of modular microelectromechanical systems, named Top-Bottom Ball Grid Array (TB-BGA), is presented. Development and standardization of homogeneous mechanical, optical, information, power supply and media interfaces are discussed. The feasibility of the modular approach is demonstrated by the realization of modular microsystems combining TB-BGA multimodule stacks, interfaces, plugs, and enclosure.