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High power multi chip modules employing the planar embedding technique and microchannel water heat sinks

 

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IEEE transactions on components, packaging and manufacturing technology. A 20 (1997), No.4, pp.432-441
ISSN: 1070-9886
English
Journal Article
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/PX-17105.html