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Gold ball bumps for adhesive flip chip assembly

 

VDI/VDE Technologiezentrum Informationstechnik:
Adhesives in Electronics '94. First International Conference on Adhesive Joining Technology in Electronics Manufacturing
Teltow: VDI/VDE-Technologiezentrum Informationstechnik, 1994
International Conference on Adhesive Joining Technology in Electronics Manufacturing <1, 1994, Berlin>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/PX-16258.html