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  4. Global standardization of compound semiconductor test methods
 
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1998
Conference Paper
Title

Global standardization of compound semiconductor test methods

Other Title
Die globale Standardisierung von Messverfahren für Verbindungshalbleiter
Abstract
The present international status of standardization for compound semiconductor materials is reviewed. A limited number of standard specifications and standard test methods have been issued or are under preparation. Two of them, standardizing the measurement of carbon in GaAs and the resistivity of semi-insulating material, are discussed in detail. The results of an inquiry on the demand for new standards are reported and a general strategy to improve international cooperation with respect to the elaboration and general acceptance of standards is outlined.
Author(s)
Jantz, W.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Mainwork
Defect recognition and image processing in semiconductors 1997. Proceedings  
Conference
International Conference on Defect Recognition and Image Processing in Semiconductors (DRIP) 1997  
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • compound semiconductor

  • material specification

  • Material-Spezifikation

  • resistivity mapping

  • Standardisierung

  • standartization

  • Verbindungshalbleiter

  • Widerstands-Topographie

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