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Patent
Title

Gehaeuse zur Aufnahme von Bauelementen und Verfahren zu dessen Herstellung

Other Title
Stackable housing for electronic component.
Abstract
NOVELTY - The circuit board has at least one flexible section so bent that the cover and base plate are mutually opposite and contain between them a spacer. The circuit board forms an intermediate layer, and comprises several flexible sections so bent that the cover, base plate, and the intermediate layer(s) form a laminate. The spacer contains a first component between the cover and intermediate layer, and a second component between the intermediate layer and the base plate. USE - For ball grid array packages, surface mounted device components, etc. ADVANTAGE - Simple, low-cost contacting on top and bottom in standard raster.
Inventor(s)
Azdasht, G.
Leutenbauer, R.
Oppermann, H.
Link to Espacenet
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=19800928A
Patent Number
1997-19744295
Publication Date
1999
Language
German
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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