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Galvanoplated 3D structures for micro systems



Microelectronic engineering 23 (1994), No.1-4, pp.455-459
ISSN: 0167-9317
International Conference on Microcircuit Engineering (ME) <19, 1993, Maastricht>
Conference Paper
Fraunhofer ISIT ()
electroplated coatings; electroplating; iron alloys; micromechanical devices; nickel alloys; photolithography

A new process for realising three dimensional microstructures is presented. Using an UV lithographic process, patterning of thick resist layers was possible. Structures with high aspect ratios up to ten were performed. The fabricated resist patterns were moulded by an electroplated Fe/Ni alloy. For the deposition of smooth and homogeneous layers a pulse electroplating system was applied. During a second manufacturing process including resist coating, UV exposure, and electroplating, the next layer of the microstructure was formed. This procedure was repeated and if necessary an intermediate plating base was additionally deposited. Removing the resist and the plating bases, the fabrication of three dimensional metal structures was completed. A three dimensional microcoil with ten windings was manufactured to demonstrate the technological potential of thick resist UV patterning combined with electroplating.