Flip-Chip-Verbindung mit nichtleitendem Klebmittel
Date Issued
1997
Author(s)
Aschenbrenner, R.
Gwiasda, J.
Zakel, E.
Eldring, J.
Patent No
1994-112626
Abstract
The method involves covering with film (20) consisting of insulative thermosetting/thermoplastic non-conductive blend adhesive. Stud bumps on the bare chips are aligned to the pattern of the substrate. The chips are bonded face down with its bumps (10) through the adhesive film to the conductive printed pattern on the substrate with a load of minimum 20 kg/cm and at a temperature up to 180 C for 15 to 20 seconds. ADVANTAGE - Provides stable interconnections giving quality attachment of bare chips on low cost organic substrates.