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Flip-Chip-Verbindung mit nichtleitendem Klebmittel

Flip chip bonding method with non conductive adhesive - by bonding chips face down with its bumps through adhesive film to conductive printed pattern on organic substrate with minium load of 20 kg per square centimetre and temperature up to 180 degrees for 15 to 20 seconds.
: Aschenbrenner, R.; Gwiasda, J.; Zakel, E.; Eldring, J.

Frontpage ()

EP 1994-112626 A: 19940812
EP 1995-916649 A: 19950413
WO 1995-EP1388 W: 19950413
EP 803132 A: 19971029
Patent, Electronic Publication
Fraunhofer IZM ()

The method involves covering with film (20) consisting of insulative thermosetting/thermoplastic non-conductive blend adhesive. Stud bumps on the bare chips are aligned to the pattern of the substrate. The chips are bonded face down with its bumps (10) through the adhesive film to the conductive printed pattern on the substrate with a load of minimum 20 kg/cm and at a temperature up to 180 C for 15 to 20 seconds. ADVANTAGE - Provides stable interconnections giving quality attachment of bare chips on low cost organic substrates.