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Flip chip technology for multi chip modules

: Jung, E.; Aschenbrenner, R.; Busse, E.; Reichl, H.


Tay, A.A.O. ; IEEE Components, Packaging, and Manufacturing Technology Society:
1st Electronic Packaging Technology Conference 1997. Proceedings
Piscataway, NJ: IEEE, 1997
ISBN: 0-7803-4157-0
ISBN: 0-7803-4158-9
Electronic Packaging Technology Conference <1, 1997, Singapore>
Conference Paper
Fraunhofer IZM ()
automotive electronics; ball grid arrays; ceramic packaging; flip-chip devices; integrated circuit packaging; laminate; multichip module; telecommunication equipment

Miniaturization is a key issue to achieve either high performance devices or to lower overall system costs. Here, flip chip technology provides excellent capabilities to fulfil the needs of both current and future requirements. In particular, the cost and performance sensitive markets of telecommunication and automotive applications are preparing to apply flip chip technology. The paper presents two product prototypes generated in a common European project, that were assembled with this target in mind. For the telecommunication sector, a low temperature cofired ceramic (LTCC) package with additional thin film wiring was chosen to provide the required interconnection density to accommodate 6 ICs on a ceramic BGA type package. For the automotive sector, a 4 IC MCM-L BGA module was assembled to provide the highest possible level of integration to allow a reduction of overall system costs.