Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Flip-chip bonding on green tape ceramic substrates
| 9th European Hybrid Microlectronics Conference. Proceedings
1993 |
| European Hybrid Microlectronics Conference <9, 1993, Nice> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |