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Flip-chip bonding on green tape ceramic substrates
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1993
Conference Paper
Titel
Flip-chip bonding on green tape ceramic substrates
Author(s)
Zakel, E.
Klöser, J.
Distler, H.
Reichl, H.
Hauptwerk
9th European Hybrid Microlectronics Conference. Proceedings
Konferenz
European Hybrid Microlectronics Conference 1993
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM