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Flip Chip attachment using nonconductive adhesives and gold ball bumps

 

International Electronics Packaging Society -IEPS-:
International Electronics Packaging Conference 1994. Proceedings
Wheaton, Ill.: International Electronics Packaging Society, 1994
ISBN: 1-88043-316-8
International Electronics Packaging Conference <1994, Atlanta/Ga.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/PX-14789.html