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Flip chip attachment using non-conductive adhesives and gold ball bumps
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1995
Journal Article
Titel
Flip chip attachment using non-conductive adhesives and gold ball bumps
Author(s)
Aschenbrenner, R.
Gwiasda, J.
Eldring, J.
Zakel, E.
Reichl, H.
Zeitschrift
International Journal of Microcircuits and Electronic Packaging
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM