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Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps



Vardaman, E.J. ; Semiconductor Equipment and Materials International -SEMI-, San Jose/Calif.; IEEE Components, Packaging, and Manufacturing Technology Society:
Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium 1996. Proceedings
Piscataway, NJ: IEEE, 1996
ISBN: 0-7803-3642-9
ISBN: 0-7803-3643-7
ISBN: 0-7803-3644-5
International Electronics Manufacturing Technology Symposium (IEMT) <19, 1996, Austin/Tex.>
Conference Paper
Fraunhofer IZM ()
adhesion; contact resistance; electroless deposited coatings; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; liquid crystal displays; microassembling; nickel; printed circuit manufacture; wafer bonding

Flip chip attachments provide the highest interconnection density possible, which makes this technology very attractive for use with liquid crystal display (LCD) packaging methods. This technology stimulated the development of new interconnection techniques, such as anisotropic adhesives. However, several factors have hindered the wide use of this technology. These factors include the availability and costs of bumped wafers. IZM and TU-Berlin have addressed both of these concerns by establishing a wafer-bumping facility which uses electroless nickel bumps. The combination of anisotropic adhesives and electroless nickel bumps has the potential for a low-cost chip on glass (COG) and chip on flex (COF) bonding technology. In this paper, two types of anisotropic adhesives were studied with an emphasis on the properties of COG and COF interconnections. The electrical and mechanical performance of the adhesive bonds was studied by evaluating initial contact resistance and mechanical adhesion as a function of temperature and humidity.