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Flip chip attachment of silicon devices using substrate ball bumping and the technology evaluation on test assemblies for 20 Gbit/s transmission
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1995
Conference Paper
Titel
Flip chip attachment of silicon devices using substrate ball bumping and the technology evaluation on test assemblies for 20 Gbit/s transmission
Author(s)
Eldring, J.
Koeffers, K.
Richter, H.
Baumgärtner, A.
Reichl, H.
Hauptwerk
ECTC '95. 45th IEEE electronic components and technology conference. Proceedings
Konferenz
IEEE Electronic Components and Technology Conference 1995
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM