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Flip chip attachment of fine pitch GaAs devices using ball bumping technology
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1994
Journal Article
Titel
Flip chip attachment of fine pitch GaAs devices using ball bumping technology
Author(s)
Eldring, J.
Zakel, E.
Reichl, H.
Zeitschrift
International Journal of Microcircuits and Electronic Packaging
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM