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Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

 

Electronic Industries Association -EIA-; IEEE Components, Packaging, and Manufacturing Technology Society:
47th Electronic Components and Technology Conference 1997. Proceedings
Piscataway/N.J.: IEEE Order Department, 1997
ISBN: 0-7803-3857-X
Electronic Components and Technology Conference (ECTC) <47, 1997, San Jose/Calif.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/PX-14432.html