1997
Conference Paper
Title

Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

Author(s)
Kloeser, J.
Heinricht, K.
Motulla, G.
Kutzner, K.
Jung, E.
Ostmann, A.
Zakel, E.
Reichl, H.
Mainwork
Conference
Language
English