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Fast CO2 laser recrystallization for 3D integration

: Haberger, K.; Panish, P.; Buchner, R.; Steinberger, H.

European SOI Workshop
European SOI Workshop <1988, Meylan>
Conference Paper
Fraunhofer IFT; 2000 dem IZM eingegliedert
3D-Integration; Laserkristallisation; MOS Transistor; Poly-Silizium; SOI

A laser recrystallization equipment has been developed using a high power CO2 laser. This system allows full wafer processing using a sweeped-line zone melt system. It has the high energy density required to maintain a temperature differential between the molten polysilicon layer and the substrate, as well as the high throughput rate of a zone processing system. MOS transistors have been fabricated in recrystallized polysilicon layers and characterized through electrical measurements. (IFT)