• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Artikel
  4. Experimental and numerical investigations of thermo-mechanically stressed micro-components
 
  • Details
  • Full
Options
1994
Journal Article
Title

Experimental and numerical investigations of thermo-mechanically stressed micro-components

Abstract
Reliability and fuctionality of microsystems, i.e. of small scale integrated electronic, mechanical and optical components depend on their mechanical and thermal constitution. The state of the art of microsystem design more and more requires direct "coupling" between simulation tools (including e.g. finite element modelling) and advanced physical experiments. The authors have combined various laser techniques, scanning microscopy, and x-ray diffraction with numerical field simulation. Problems of electronic packaging in microsystems are dealt with. Fracture and crack phenomena, life time estimation of microcomponents and elasto-plastic phenomena are reported.
Author(s)
Michel, B.
Schubert, A.
Dudek, R.
Grosser, V.
Journal
Microsystem Technologies  
DOI
10.1007/BF01367756
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • electronic packaging

  • finite element analysis

  • glob top

  • laser metrology

  • mechanical reliability

  • mechanical stress

  • microsystem technology

  • SMT

  • solder joints

  • x-ray stress analysis

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024