• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Experience with a fully automatic flip-chip assembly line integrating SMT
 
  • Details
  • Full
Options
1998
Conference Paper
Title

Experience with a fully automatic flip-chip assembly line integrating SMT

Abstract
The Fraunhofer Institute (FhG/IZM-Berlin) together with several industrial partners has set up a demonstration center for the assembly of flip chips (FC) and chip size packages (CSP). It consists of a complete production line, and additional equipment for quality control and process development. The central interest is the implementation of cost effective, high reliability and environmentally friendly processes. To achieve these goals, upscaling existing flip chip technologies from laboratory examples to industrial production is necessary. At the same time, the technologies must be optimized to guarantee a high quality standard and good yield in high volume production. In order to demonstrate the high performance of these cost effective flip chip technologies, the process flows of different flip chip assembly techniques using solder are compared and described in detail. It is important to note that flip chips and CSPs can be used in conjunction with standard surface mount technology (SMT) devices. The development of these processes was performed by simultaneous engineering. Finally, the yield and costs are estimated and the reliability results of a selected flip chip process are presented.
Author(s)
Klöser, J.
Kutzner, K.
Jung, E.
Heinricht, K.
Lauter, L.
Töpper, M.
Mainwork
NEPCON WEST '98. Proceedings of the Technical Program. Vol. 2  
Conference
NEPCON WEST 1998  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • chip-on-board packaging

  • chip scale packaging

  • computer intergrated manufacturing

  • concurrent engineering

  • flip-chip devices

  • integrated circuit reliability

  • integrated circuit yield

  • microassembling

  • printed circuit manufacture

  • quality control

  • Soldering

  • surface mount technology

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024