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Environmental screening of packaging and interconnection technologies

 

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Yoshikawa, H.; Yamamoto, R.; Kimura, F.; Suga, T.; Umeda, Y. ; IEEE Computer Society, Technical Committee on Electronics and the Environment:
First International Symposium on Environmentally Conscious Design and Inverse Manufacturing 1999. Proceedings
Los Alamitos, Calif.: IEEE Computer Society, 1999
ISBN: 0-7695-0007-2
ISBN: 0-7695-0009-9
pp.754-759
International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign) <1, 1999, Tokyo>
English
Conference Paper
Fraunhofer IZM ()
electronics industry; environmental factors; interconnection; packaging

Abstract
As a complement to life cycle assessment various environmental screening models have been developed. The screening parameter discussed in this paper addresses the toxicity of materials in electronic products. Obviously the material content of electronic assemblies is also needed for all other methods which distinguish down to the technology level and therefore serve as a starting point for more detailed environmental investigations. The modern packaging and interconnection technologies are driving forces behind the miniaturization of electronics in general and are used as parameters for a trend analysis of future electronics.

: http://publica.fraunhofer.de/documents/PX-12662.html