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1991
Book
Titel
Entwicklung von neuen Klebtechnologien in der Elektronik
Abstract
The book on hand is the result of a study and a research project. Both were supported by the German ministry of research and technology. The partner in this research project have been as follows: the division structure and compositives of the Fraunhofer- Institut für Angewandte Materialforschung(IFAM) in Bremen; the division development, material- and procedure technology of the company SEL-Alcatel in Stuttgart and the field research metal of the company Degussa in Hanau. The puplishers and their colleagues express their thanks to the German ministery of research and technology for the support as well as Dr. Reese of the VDI/VDE Technologiezentrum Informationstechnik GmbH in Berlin for the good co- operation. Besides a study of "adhesive bonding technology in the electronics" the book contains in the technological part the "material development for the application of conductive adhesives for SMD", the " procedures for the application of conductive adhesives for SMD" as well as "technol ogical investigations on conductive adhesive for SMD".