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Entwicklung neuartiger Umhüllmassen für die Mikroelektronik

 
: Gesang, T.; Hennemann, O.-D.

Verbindungstechnik in der Elektronik 4 (1992), No.3, pp.128-132
ISSN: 0935-4441
German
Journal Article
Fraunhofer IFAM ()
ageing; Alterung; Benetzung; bond strength; Grenzfläche; injection molding; interface; leadframe; mechanische Spannung; microelectronics; Mikroelektronik; packaging; Spritzguß; stress; thermoplast; Umhüllmasse; Verbundfestigkeit; Wasserdiffusion; water diffusion; wetting

Abstract
Novel thermoplastic packaging materials were developed and compared with standard duroplasts. This contribution is concerned with the peculiarities of the bond formation as well as with the interface packaging material - leadframe. An optimisation of the injection moulding process, the packaging material and the leadframe surface is possible.

: http://publica.fraunhofer.de/documents/PX-12439.html