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1992
Journal Article
Titel
Entwicklung neuartiger Umhüllmassen für die Mikroelektronik
Abstract
Novel thermoplastic packaging materials were developed and compared with standard duroplasts. This contribution is concerned with the peculiarities of the bond formation as well as with the interface packaging material - leadframe. An optimisation of the injection moulding process, the packaging material and the leadframe surface is possible.
Language
German