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Entwicklung neuartiger Umhüllmassen für die Mikroelektronik

: Gesang, T.; Hennemann, O.-D.

Adhäsion 36 (1992), No.6, pp.31-34
ISSN: 0001-8198
Journal Article
Fraunhofer IFAM ()
Adhäsion; adhesion; ageing; Alterung; Benetzung; diffusion; Grenzfläche; injection molding; interface; leadframe; mechanical stress; mechanische Spannung; microelectronics; Mikroelektronik; packaging; Spritzguß; thermoplast; Umhüllmasse; wetting

Thermoplastic packaging materials have some advantages over duromers: shorter cycletimes, automisation easier, ecological favourable. Moreover the bond strength packaging material - leadframe is higher and can be further increased by a pretreatment of the leadframe. The bond strength after aging and the diffusion of water along the interface are comparable for thermoplast and duromer. The injection molding parameters have to be modified in order to ensure good wetting. The chemical groups which makes the adhesion were identified. Hints for the reduction of internal mechanical stress in the interface are given.