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Electroless Nickel/Copper plating as a new bump metallization
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1994
Conference Paper
Titel
Electroless Nickel/Copper plating as a new bump metallization
Author(s)
Aschenbrenner, R.
Ostmann, A.
Beutler, U.
Simon, J.
Reichl, H.
Hauptwerk
3rd International Conference on MCM '94
Konferenz
International Conference on MCM 1994
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM