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  4. Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik
 
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1995
Conference Paper
Title

Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik

Abstract
In microelectronics the problem of interconnected materials of different kind (metals, ceramics, polymeric materials) is of growing importance. Mechanical and thermal misfit problems have a dominant influence upon the reliability of electronic components and systems as well. The author deals with applications of so-called "Fracture Electronics". Several examples of electronic packaging technologies are discussed (chip cards technologies, flip chip, chip-on-board) under the special aspects of material mechanics problems.
Author(s)
Michel, B.
Mainwork
Verbundwerkstoffe und Werkstoffverbunde 1995  
Conference
Tagung Verbundwerkstoffe und Werkstoffverbunde 1995  
Language
German
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • electronic packaging

  • fracture electronics

  • material mechanics

  • mechanical reliability

  • micromechanics

  • microsystem technology

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