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Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik

 
: Michel, B.

Ziegler, G. ; Deutsche Gesellschaft für Materialkunde e.V. -DGM-, Oberursel:
Verbundwerkstoffe und Werkstoffverbunde 1995
Oberursel: DGM-Informationsgesellschaft, 1996
ISBN: 3-88355-219-4
pp.96
Tagung Verbundwerkstoffe und Werkstoffverbunde <1995, Bayreuth>
German
Conference Paper
Fraunhofer IZM ()
electronic packaging; fracture electronics; material mechanics; mechanical reliability; micromechanics; microsystem technology

Abstract
In microelectronics the problem of interconnected materials of different kind (metals, ceramics, polymeric materials) is of growing importance. Mechanical and thermal misfit problems have a dominant influence upon the reliability of electronic components and systems as well. The author deals with applications of so-called "Fracture Electronics". Several examples of electronic packaging technologies are discussed (chip cards technologies, flip chip, chip-on-board) under the special aspects of material mechanics problems.

: http://publica.fraunhofer.de/documents/PX-10795.html