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2001
Book Article
Titel
NDT of electronic components and structural ceramics
Abstract
In electronic components like integrated circuits and power devices with plastic of ceramic encapsulation, reliability is affected by tiny defects that may be harbored within a component or assembly. The defects may grow with thermal cycling or accidental mechanical or electrical overload. When they reach a critical size, electrical performance may be affected, that is, a connection may break, or an electrial characteristic may change At teh end of the production process electrical and other tests are usually employed to ensure that only high-quality products are delivered to customers. An excellent overview about materials and testing in microelectronics can be found in the conference proceedings on micromaterials published by the German Society for Materials Testing in Berlin, Germany.